Thin-film Process Capabilities

• Static and roll-to-roll deposition (vacuum and non-vacuum)
• Pin-hole free single layers to multiple layer depositions
• Un-patterned depositions
• Up to 13" wide and 1800’ long
• Patterned depositions
• Macro registered masks
• Laser scribing and ink jet filling
• Optical lithography
• E-beam lithography (as small as 20nm feature size)

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ITN has Broad capabilities to support thin-film process development

Thin-film Material Processing Experience

• Metals
  • Mo, Cu, In, Al, Zn, Ga, Se, Li, Ni, Cr, Ag, Au, Pt, Ti, Ta, NiFe, NiFeCr
• Non-metals and semiconductors
  • C, DLC, a-Si:H, a-SiC:H, a-SiGe:H, a-Ge:H, microcrystalline Si, CdS, CIGS, CIS, CIAS, CdTe, NaF, MgF, LiF
• Dielectrics
  • ZnO, Al2O3, SiN, SiO2, iZnO, NbOx, TiOx, Nb2O5, Ti2O3
• Conducting Oxides
  • ITO,  doped ZnO, LiV2O5, LiCoO2
• Substrates
  • Flexible (various stainless steels, TiAl, PET,
    polyimide, silicone-based, Cu)
  • Rigid (various glasses, silica, alumina)

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ITN has Substantial know-how to help solve thin-film challenges

Thin-film Deposition Capabilities

• 20 plus vacuum deposition chambers supporting:
• Sputtering (cathode arc, RF magnetron, direct current magnetron)
• Chemical vapor deposition (CVD) and plasma enhanced CVD (PEVCD)
• Atmospheric pressure CVD (APCVD)
• Evaporative deposition (resistive, e-beam, ion-beam, ion-assisted)
• Atomic layer deposition (ALD)
• Ion milling
• Diamond-like carbon deposition
• Chemical spray deposition on a roll-to-roll basis

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ITN has Broad capabilities to support thin-film device process development

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