Electron
Beam Lithography
- Feature Sizes Down to 20 nm
- Multilayer Device Fabrication
- Ultra-Fine Features Over Large Area
(up to 8” wafers)

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Near Field Scanning Optical
Microscope
- Feature Sizes Down to 100 nm
- 1 mm x 1mm Continuous Write w/o Stitch
and Repeat
- Layer to Layer Alignment w/o Fiducial
Marks

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Photolithography (Contact Mask
Aligner)
- Feature Sizes Down to 2 microns
- Up to 3” Wafers

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Class 1,000 Clean Room
- Resist Spinner
- Plasma Ashing Station

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Ion Mill Station |